COMe Eval Carrier2 T10

COM Express® Evaluation Carrier Type 10
Specifications
  • COM Express® Rev. 2.1, Pin-out Type 10
  • ATX Form Factor (305mm x 244mm)
  • DisplayPort and LVDS
  • Full support for Type 10 featureset
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The Evaluation carrier board for COM Express® mini COMs is designed to allow embedded application developers to get up and running quickly on the COM Express® mini modular platform, giving them a head start on the total system design. Simply select a Kontron COM Express® mini CPU module, then Plug & Go.

The COM Express® Evaluation Carrier Type 10 is designed for COM Express® mini COMs, offering interfaces for PCI Express,  SATA, USB 2.0, LVDS,DisplayPortI, Gigabit Ethernet and more. With a complete array of connectors brought out on this carrier board, it serves as a reference design for other more customized variations.

The COM Express® format represents a more cost effective replacement to time and resource consuming full custom designs.Time to market is dramatically reduced and future upgrades are as simple as choosing a new COM Express® CPU module. Therefore, the total cost of ownership of the end design is improved as well.

Features

Compliance COM Express® Rev. 2.1

Pin-out Type 10
Dimensions (H x W x D) 305 x 244 mm (ATX)
Supported Modules COM Express® mini with pin-out Type 10
Graphics 1x LVDS/JILI FFC40 connector

1x DisplayPort
Hard Disk 1x SATA

1x mSATA socket

1x SD-Card
USB 2x USB 3.0/2.0

5x USB 2.0
PCI Express / PCI support 2x PCIe x16 (electrically x1)

1x PCIe x1

1x miniPCIe (with USB)
Audio Realtek ALC888 HD-Audio

S/PDIF in/out
Ethernet 1x 10/100/1000 MBit RJ 45 connector
Serial 2x UART on pin-header

2x RS232 from SIO
Special Features 1x PWM Fan from COM

SPI and LPC boot

Hardware Power Button simulation
Common Features Port80 POST Code Display
Options Carrier EEPROM
Power Supply ATX power supply 24+4 pin

Wide Range Input support on 4pin Connector for Module Supply
Temperature Operation: 0° to 60°C

Storage: -30° to 85°C
Humidity 93% relative Humidity at 40°C, non-condensing

(according to IEC 60068-2-78)

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Datasheets

Datasheet COMe Eval-Carrier T10 Gen2
[ come-eval-carrier2-t10_datasheet.pdf, 442.74 KB, Jun.25.2024 ]

Manuals

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

White Papers

Robotic-Assisted Surgery White Paper
[ white-paper-beyond-science-fiction-robotic-assisted-surgery.pdf, 6.43 MB, Dec.17.2024 ]

Use Cases

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

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