COMe-cEL6 (E2) product.new

COM Express® compact Type 6 with Intel Atom® x6000E, Pentium® and Celeron® Series

Specifications

Low-power – performance/watt optimized form factor solution
Up to 32 GByte DDR4-3200 Memory via 2x SODIMM sockets (In-Band ECC)
Triple display support
6x PCIe 3.0 lanes
Up to 4x USB 3.1/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
1GbE (optional 2.5GbE) with TSN support
Industrial grade temperature

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The COMe-cEL6 COM Express compact Type 6 module is highly scalable and covers the entire range of Intel's x6000 IoT-ready embedded processors. The COMe-cEL6 portfolio range from a cost optimized dual-core Intel Celeron (2x 1.2 GHz with 6W TDP) iteration optimized for energy-sensitive applications to genuine quad-core Intel Atom (4x 1.9 with 12W TDP) versions for high-end real-time applications.

Users benefit from a significantly improved computing performance, an impressive performance-per-watt ratio and the long-term availability inherent in all Kontron embedded solutions.

Features

Compliance

COM Express® compact, Pin-out Type 6 - COM.0 R3.0

Dimension (H x W)

95 x 95 mm

CPU

COMe-cEL6:

Intel® Celeron® J6413, 4C, 1.8/3.0GHz, 16EU, 10W

Intel® Pentium® J6426, 4C, 2.0/3.0GHz, 32EU, 10W

Intel® Celeron® N6211, 2C, 1.2/3.0GHz, 16EU, 6.5W

Intel® Pentium® N6415, 4C, 1.2/3.0GHz, 16EU, 6.5W

COMe-cEL6 E2:

Intel® Atom® x6211E, 2C, 1.3/3.0GHz, 16EU, 6W

Intel® Atom® x6413E, 4C, 1.5/3.0GHz, 16EU, 9W

Intel® Atom® x6425E, 4C, 2.0/3.0GHz, 32EU, 12W

Intel® Atom® x6212RE, 2C, 1.2GHz/-, 16EU, 6W

Intel® Atom® x6214RE, 2C, 1.4GHz/-, 16EU, 6W

Intel® Atom® x6414RE, 4C, 1.5GHz/-, 16EU, 9W

Intel® Atom® x6416RE, 4C, 1.7GHz/-, 16EU, 9W

Intel® Atom® x6425RE, 4C, 1.8GHz/-, 32EU, 12W

Chipset

Integrated in SOC

Main Memory

Up to 32 GByte DDR4-3200 via 2x SODIMM sockets (In-Band ECC)

Graphics Controller

SOC: Intel® HD Gfx Gen11: 1x LVDS/eDP (3840 x 2160 @ 60 Hz) 2x DP (++) on DDI1/DDI2 up to 4K

Ethernet Controller

SOC + LAN PHY GPY115 (GPY215 on request)

Ethernet

1GBit Ethernet (2.5GBit on request with GPY215)

Storage

2x SATA 6Gb/s

Flash Onboard

Build option:

- up to 84 GByte eMMC pSLC

- up to 256 GByte eMMC TLC

PCI Express

6x PCIe Gen 3.0 lanes - PCIe lane configurations: 1 x4 /2 x2 / 4 x1 + 1 x2 / 2 x1

Display

DDI 1/2: DP++, LVDS: Dual Channel up to 48-bit or eDP on request

USB	Default: 2x USB 3.1 (incl. USB 2.0) + 6x USB 2.0 Option: 4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0 USB 2.0 port7 does support dual role (Client/Host)

Serial

2x serial interface (RX/TX only)

Audio

Intel® High Definition Audio

Common Features

SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC

Special Features

Industrial grade temperature

Options

eMMC Flash option (up to 84 GByte pSLC, up to 256 GByte MLC)

eDP instead of LVDS

General Purpose SPI instead of Boot SPI

eSPI instead of LPC to the COMe connector

4x USB3.1 w/ add USB-Hub instead of 2x USB 3.1

USB client,
Trusted Platform Module TPM 2.0,
de-populated LAN PHY

Power Management

ACPI 6.0

Power Supply

8.5 V – 20 V Wide Range, Single Supply Power

BIOS	AMI Aptio V

Operating System

Windows® 10, Linux, VxWorks

Temperature

COMe-cEL6- commercial temperature:

0° C to +60° C operating

-30° C to +85° C non-operating

COMe-cEL6 E2 - industrial temperature:

-40° C to +85° C operating

-40° C to +85° C non-operating

Humidity

93% relative Humidity at 40°C, non-condensing

(according to IEC 60068-2-78)

Supported Modules

commercial temperature:

COMe-cEL6 (36033-xxxx-xx-x)

industrial temperature:

COMe-cEL6 E2 (36034-xxxx-xx-x)

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Datasheets

Datasheet COMe-cEL6
[ come-cel6_datasheet.pdf, 449.37 KB, Nov.15.2024 ]

Manuals

COMe-cEL6 (E2) User Guide
Rev 1.5
[ come-cel6_user-guide_rev-1-5_2024-1028.pdf, 3.64 MB, Oct.28.2024 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

White Papers

Robotic-Assisted Surgery White Paper
[ white-paper-beyond-science-fiction-robotic-assisted-surgery.pdf, 6.43 MB, Dec.17.2024 ]

Use Cases

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

Tech Spec Sheet

COM EXPRESS® compact
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]

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Accessories

COMe Eval Carrier2 T6
38116-0000-00-5

COM Express® Eval Carrier2 Type 6 with 5mm COMe connector

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