COMe-cDV7 (E2)

COM Express® compact Type 7 with Intel® Atom® processor C3000 product family

Specifications

Entry level space-optimized server-grade platform
Quad 10 GbE interfaces
High-speed connectivity PCIe 3.0, SATA3, USB 3.0
Up to 64GB DDR4 memory
Industrial grade versions

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This COM Express module extends Kontron’s product family of server-class COM platforms. The COMe-cDV7 is the smaller version of the COMe-bDV7 (COM Express basic) – dedicated for use in extremely space-constraint applications. The COMe-cDV7 module features server-grade CPU performance with up to 16 cores and two SODIMM sockets for up to 2x 32GB DDR4 memory offering a well-balanced core count vs memory size implementation. Available interfaces are up to 14x PCIe Gen 3.0 lanes, up to 3x USB 3.0, 2x SATA Gen3, 2x UARTs and optionally support of eMMC 5.1. In combination with the up to four 10GbE-KR ports the COMe-cDV7 is ideally suited for network intensive implementations. The KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) on the base board.

Features

Compliance

COM Express® compact, Pin-out Type 7 - COM.0 R3.0

Dimension (H x W)

95 mm x 95 mm

CPU

Commercial temperature:
Intel® Atom® Processor C3958, 16C, 2.0GHz, 31W TDP
Intel® Atom® Processor C3858, 12C, 2.0GHz, 25W TDP
Intel® Atom® Processor C3758, 8C, 2.2GHz, 25W TDP
Intel® Atom® Processor C3538, 4C, 2.1GHz, 15W TDP
Industrial temperature:
Intel® Atom® Processor C3808, 12C, 2.0 GHz, 25 W TDP
Intel® Atom® Processor C3708, 8C, 1.7 GHz, 17 W TDP
Intel® Atom® Processor C3508, 4C, 1.5 GHz, 11 W TDP
Intel® Atom® Processor C3308, 2C, 1.6 GHz, 9 W TDP

Panel signal

Audio

Main Memory

2x DDR4 SODIMM for up to 64 GByte ECC / non ECC

Graphics Controller

Chipset

Integrated in SoC

Ethernet

1x 10/100/1000 MBit Ethernet
Up to 4x 10GbE Interfaces (KR) – depending on C3000 SKU

Ethernet Controller

Intel® I210IT (uses one lane of PCIe 3.0) - 1 GbE
Intel® Quad LAN integrated in SoC - up to 4x 10 GbE

Hard Disk

Up to 2x SATA3, 6Gb/s

Options

eMMC 5.x up to 64 GByte pSLC or 128GByte MLC (build option)

PCI Express / PCI support

Up to 14x PCIe 3.0 lanes - depending on C3000 SKU

USB	Up to 3x USB3.0 / 4x USB2.0

Serial

2x serial interface (RX/TX only)

Common Features

SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC

BIOS

AMI UEFI

Humidity

93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)

Power Management

ACPI 5.0

Power Supply

ATX, 8.5 V – 20 V Wide Range, Single Supply Power

Special Features

Trusted Platfom Module TPM 2.0

Operating System

Linux, Windows® Server 2012 / 2012 R2 / 2016, Windows® 7, VxWorks 7

Temperature

Commercial temperature 0 - 60 °C
Industrial temperature -40 °C to +85 °C (specified SKUs only)

Supported Modules

COMe-cDV7 : commercial grade 66002-xxxx-xx-x
COMe-cDV7 E2 : industrial grade 66003-xxxx-xx-x

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Datasheets

Datasheet COMe-cDV7
[ come-cdv7_20190524_datasheet.pdf, 2.7 MB, Oct.21.2019 ]

Manuals

COMe-cDV7 (E2) User Guide
Rev. 1.4
[ come-cdv7_user-guide_rev-1-4_2024-1129.pdf, 3.47 MB, Nov.29.2024 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

White Papers

Robotic-Assisted Surgery White Paper
[ white-paper-beyond-science-fiction-robotic-assisted-surgery.pdf, 6.43 MB, Dec.17.2024 ]

Use Cases

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

Tech Spec Sheet

COM EXPRESS® compact
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]

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