COMe-bSL6
COM Express® basic Type 6
with 6th Generation Intel® Core™ Processors
Specifications
- Intel® 6th Generation Core™ series / Xeon® E3 v5 family with CM236/QM170 PCH
- Up to 32 GByte DDR4 non-ECC/ECC memory
- Industrial grade versions
- Support of Kontron’s Embedded Security Solution (Approtect)
COMe-bSL6 and COMe-bSL6R E2S deliver a new generation of high performance, feature-rich COM-modules based on the COM Express® basic standard form factor (125 x 95mm) and Intel® 6th Generation Core™ / Xeon® E3 v5 Family processors. These new application-ready modules feature increased CPU and graphics performance compared to its predecessors. Integrated high performance Intel® HD Graphics or Intel® Iris™ Pro Graphics with 128M of on-package cache memory, can support three independent displays with up to 4K resolution, enable developers to create applications that provide excellent user experiences. In addition, the broad scalability of CPU performance grades gives users full flexibility to choose the optimal performance solution that matches their operational requirements.
Both models support up to 32 GB of ECC/non-ECC DDR4 memory, resulting in a reduction in overall power consumption compared to DDR3-based COMs. The Kontron COMe-bSL6R E2S offers industrial grade features making it an ideal platform for applications in harsh and rugged environments.
The COMe-bSL6 and COMe-bSL6R E2S modules are equipped with Kontron’s standard hardware-based embedded Security Solution Approtect, so developers integrating the COMe-bSL6 / COMe-bSL6R E2S can more easily harden their application against a wide variety of security risks.
Learn more about the security solution Approtect here: Security Solution - Approtect
Features
| Compliance | COM Express® basic, Pin-out Type 6 |
| Dimensions (H x W x D) | 125 x 95 mm |
| CPU | Intel® Xeon® E3-1515M, Intel® Xeon® E3-1505M, Intel® Xeon® E3-1505L, Intel® Core™ i7-6820EQ, Intel® Core™ i7-6822EQ, Intel® Core™ i5-6440EQ, Intel® Core™ i5-6442EQ, Intel® Core™ i3-6100E, Intel® Core™ i3-6102E, Intel® Celeron™ G3900E, Intel® Celeron™ G3902E |
| Chipset | Intel® Mobile CM236 / Intel® Mobile QM170 (Core™ i5 & Core™ i7) |
| Main Memory | 2x DDR4-2133 SO-DIMM up to 2x 16 GByte (non-ECC/ECC) |
| Graphics Controller | Intel® Iris™ Pro Graphics P580 (GT4e) Intel® HD Graphics P530 (GT2) Intel® HD Graphics P510 (GT1) |
| Ethernet Controller | Intel® I219LM |
| Ethernet | 10/100/1000 MBit Ethernet |
| Hard Disk | 4x SATA3 6Gb/s |
| PCI Express / PCI support | 8x PCIe x1, 1x PEG x16 |
| Panel signal | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit |
| USB | 4x USB 3.0 (incl. USB 2.0) + 4x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | Intel® High Defi nition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS |
| BIOS | AMI Aptio V |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Options | vPRO (AMT/TXT/AES Support), eDP instead of LVDS, VGA, Intel® Mobile HM170 Chipset |
| Power Management | ACPI 4.0, S5 Eco |
| Power Supply | 8.5 V - 20 V Wide Range, Single Supply Power |
| Special Features | POSCAP capacitors, Trusted Platfom Module TPM 2.0, Security Chip, 4k Resolutions, Flexible PEG lane configuration by Setup Option |
| Operating System | Windows® 10, Windows® 8.1, Windows® 7, WEI8, WE8S, WES7, Linux, VxWorks |
| Temperature | Commercial temperature: 0° C to +60° C operating, -30° C to +85° C non-operating Extended temperature: -25° C to +75° C operating, -30° C to +85° C non-operating Industrial temperature: -40° C to +85° C operating, -40° C to +85° C non-operating |
| Supported Modules | COMe-bSL6 xx-xxxxxx CM236/QM170 COMe-bSL6R E2S xx-xxxxxx CM236 |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheets
Datasheet COMe-bSL6
[ come-bsl6_datasheet.pdf, 3.08 MB, Feb.28.2022 ]
Datasheet COMe-bSL6R E2S
[ come-bsl6-e2s_datasheet.pdf, 3.08 MB, Feb.28.2022 ]
Manuals
COMe-bSL6 user manual
Rev. 1.8
Jul. 28, 2022
[ come-bsl6-user-guide_rev-1-8_2022-07-28.pdf, 2.11 MB, Apr.20.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
Robotic-Assisted Surgery White Paper
[ white-paper-beyond-science-fiction-robotic-assisted-surgery.pdf, 6.43 MB, Dec.17.2024 ]
Use Cases
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
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Accessories
|
COMe Eval Carrier2 T6
38116-0000-00-5 |
|
COM Express® Eval Carrier2 Type 6 with 5mm COMe connector | more |
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