COMe-bID7 product.new

COM Express® basic Type 7 with Intel® Xeon® D-1700 / D-1800 processor family

Specifications

Server-grade platform based on Intel® Xeon® D-1700 / D-1800 processor family
Quad 10 GbE interfaces
High-speed connectivity 16x PCIe 4.0 + 16x PCIe 3.0, SATA, USB 3.0
Up to 1 TByte NVMe SSD onboard
Industrial grade versions

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The COMe-bID7 (E2) with scalability from 4 to 10 cores on a small form factor and SKUs for industrial temperature range of -40°C up to +85° as well as 24x7 / 10 years reliability allows robust, space-constraint implementations in harsh environments and extreme conditions.

The module accommodates up to 4x SO-DIMM sockets for a max. of 128GB memory. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.

16x PCIe Gen4 plus 16x PCIe Gen3 lanes and 4x 10GBASE-KR interfaces provide an ideal support for high data throughput requirements in demanding I/O and network structures.

The 10GBASE-KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) - on the base board.

Features

Compliance

COM Express® basic, Pin-out Type 7 - COM.0 R3.1 by default, COM.0 R3.0 on request

Dimensions (H x W x D)

125 x 95 mm

CPU

Intel® Xeon® D-1749NT, 90W, 10 core, 3.0GHz
Intel® Xeon® D-1735TR, 59W, 8 core, 2.2GHz
Intel® Xeon® D-1712TR, 40W, 4 core, 2.0GHz
Intel® Xeon® D-1747NTE, 80W, 10 core, 2.5GHz, ind. temp.
Intel® Xeon® D-1746TER, 67/56W, 10 core, 2.0GHz, ind. temp.
Intel® Xeon® D-1732TE, 52W, 8 core, 1.9GHz, ind. temp.
Intel® Xeon® D-1715TER, 50W, 4 core, 2.4GHz, ind. temp.
see complete list in COMe-bID7 datasheet

Chipset

Integrated in SoC

Main Memory

2x DDR4 SODIMM for up to 64 GByte ECC (non ECC on request)
on request: 4x DDR4 SODIMM for up to 128 GByte ECC (non ECC on request)

Graphics Controller

Ethernet Controller

Intel® I225LM/IT
Intel® Quad 10GbE LAN integrated in SoC

Ethernet

1x 1/2.5 Gb (1/2.5 GBASE-T)
4x 10Gb (10 GBASE-KR)

Storage

2x SATA3, 6Gb/s

Flash Onboard

Up to 1 TByte NVMe SSD (on request)

PCI Express

16x PCIe Gen4 (1 x16, 2 x8, 4 x4)
16x PCIe Gen3 (2 x8, 4 x4, 8 x2)

Display

USB	4x USB 3.0 (4x USB 2.0)

Serial

2x serial interface (RX/TX only)

Audio

Special Features

TPM 2.0, NVMe SSD, additional 3rd and 4th SODIMM socket

Power Management

ACPI 6.0

Power Supply

Commercial temperature: 8.5 V - 20 V Wide Range
Industrial temperature: 12 V DC +/- 5%

BIOS

AMI UEFI

Operating System

Linux, Windows 10 IoT Enterprise, Windows Server 2022

Temperature

Commercial temperature: 0 °C to +60 °C operating,
-30 °C to +85 °C non-operating
Industrial temperature: -40 °C to +85 °C operating,
-40 °C to +85 °C non-operating

Humidity

93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)

Supported Modules

COMe-bID7 xxxxx commercial grade
COMe-bID7 E2 xxxxx industrial grade

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Datasheets

Datasheet COMe-bID7
[ come-bid7_data-sheet.pdf, 517.06 KB, Feb.19.2024 ]

Manuals

COMe-bID7 User Guide
[ come-bid7_user-guide_rev-1-6_2024-0216_w2016.pdf, 3.64 MB, Feb.19.2024 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

White Papers

Robotic-Assisted Surgery White Paper
[ white-paper-beyond-science-fiction-robotic-assisted-surgery.pdf, 6.43 MB, Dec.17.2024 ]

Use Cases

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

Tech Spec Sheet

Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]

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Accessories

COMe Eval Carrier T7 Gen2

COM Express® Eval Carrier Type 7

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