COMe-bDV7

COM Express® basic Type 7 with Intel® Atom® processor C3000 product family

Specifications

Entry level server-grade platform
Quad 10 GbE interfaces
High-speed connectivity PCIe 3.0, SATA3, USB 3.0
Up to 128GB DDR4 memory
Industrial grade versions

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The COM Express® module COMe-bDV7 based on the Intel® Atom® processor C3000 series extends Kontron’s product family of server-grade COM platforms. The COMe-bDV7 as an entry level platform is as a complementary product to the high performance class COMe-bBD7 equipped with the Intel® Xeon® processor D-1500 series. The COMe-bDV7 module features scalable CPU performance with up to 16 cores. This robust performance is combined with support for up to four 10GbE-KR ports making it ideal for network intensive implementations. The KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) on the base board in conjunction with a suitable PHY.

In addition, the COMe-bDV7 offers high-speed connectivity from configurable PCIe Gen3.0 lanes for high I/O performance demands. Offering a well-balanced multi-core CPU versus memory-size approach, it supports up to 64GB ECC or non-ECC DDR4 memory via two SODIMM sockets, optionally up to 128 GB via 4 SODIMM sockets .

Features

Compliance

COM Express® basic, Pin-out Type 7 - COM.0 R3.0

Dimension (H x W)

125 mm x 95 mm

CPU

Commercial temperature:
Intel® Atom® Processor C3958, 16C, 2.0GHz, 31W TDP
Intel® Atom® Processor C3858, 12C, 2.0GHz, 25W TDP
Intel® Atom® Processor C3758, 8C, 2.2GHz, 25W TDP
Intel® Atom® Processor C3558, 4C, 2.2GHz, 16W TDP
Industrial temperature:
Intel® Atom® Processor C3808, 12C, 2.0 GHz, 25 W TDP
Intel® Atom® Processor C3708, 8C, 1.7 GHz, 17 W TDP
Intel® Atom® Processor C3508, 4C, 1.5 GHz, 11 W TDP
Intel® Atom® Processor C3308, 2C, 1.6 GHz, 9 W TDP

Panel signal

Audio

Main Memory

2x DDR4 SODIMM for up to 64 GByte ECC / non ECC
on request: 4x DDR4 SODIMM for up to 128 GByte ECC / non ECC

Graphics Controller

Chipset

Integrated in SoC

Ethernet

1x 10/100/1000 MBit Ethernet
Up to 4x 10GbE Interfaces (KR) – depending on C3000 SKU

Ethernet Controller

Intel® I210IT (uses one lane of PCIe 3.0) - 1 GbE
Intel® Quad LAN integrated in SoC - up to 4x 10 GbE

Hard Disk

Up to 2x SATA3, 6Gb/s

Options

eMMC 5.1 (build option)

PCI Express / PCI support

Up to 14x PCIe 3.0 lanes - depending on C3000 SKU

USB	Up to 3x USB3.0 / 4x USB2.0

Serial

2x serial interface (RX/TX only)

Common Features

SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC

BIOS

AMI UEFI

Humidity

93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)

Power Management

ACPI 5.0

Power Supply

ATX, 8.5 V – 20 V Wide Range, Single Supply Power

Special Features

Trusted Platfom Module TPM 2.0

Operating System

Linux, Windows® Server 2012 / 2012 R2 / 2016, Windows® 7, VxWorks 7

Temperature

Commercial temperature 0 - 60 °C
Industrial temperature -40 °C to +85 °C (specified SKUs only)

Supported Modules

COMe-bDV7 : commercial grade 68006-xxxx-xx-x
COMe-bDV7 E2 : industrial grade 68007-xxxx-xx-x

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Datasheets

Datasheet COMe-bDV7
[ come-bdv7_20210125_datasheet.pdf, 1.89 MB, Feb.02.2021 ]

Manuals

COMe-bDV7 user guide
Rev 2.0
[ come-bdv7_user-guide_rev-2-0_2024-1129.pdf, 3.15 MB, Nov.29.2024 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

White Papers

Robotic-Assisted Surgery White Paper
[ white-paper-beyond-science-fiction-robotic-assisted-surgery.pdf, 6.43 MB, Dec.17.2024 ]

Use Cases

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

Tech Spec Sheet

Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]

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Accessories

COMe Eval Carrier T7 Gen2		COM Express® Eval Carrier Type 7	more
COMe Eval Carrier T7 68300-0000-00-0		COM Express® Eval Carrier Type 7	more

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