COMe-bCL6

COM Express® Basic Type 6 with 8th/9th Generation Intel® Core™ / Xeon® Processors

Specifications

Intel® 8th/9th Generation Core™ series / Xeon® E family with CM246/QM370 PCH
Up to 128 GByte DDR4 non-ECC/ECC memory
Optional NVMe SSD onboard
Industrial grade versions
Support of Kontron’s Embedded Security Solution (APPROTECT)

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The COMe-bCL6(R E2S) offers increased performance density together with excellent graphic support on a standardized Type 6 Computer-on-Module based on the COM Express basic form factor.

Through the use of consistent COM Express connectors and feature implementation, the COMe-bCL6 is easily exchangeable and offers the most flexibility for customers designing it into their embedded devices based on individual carrier boards.

Especially the introduction of a hexa core CPU, memory expansion to possible 128GB, additional NVMe SSD onboard and the continuation of the Intel® Optane™ fast memory support for system acceleration shall be a differentiator to former applications.

Typical application areas can be found in markets such as communication, digital signage, professional gaming and entertainment, medical imaging and surveillance and security as well as industrial plant and machine line control on shop floor- and control room-level.

In addition the rugged R E2S modules – which offer Rapid shutdown functionality, ECC memory support and industrial grade temp. range usage – meet the special requirements of applications for the Military/Defense and Transportation market.

Features

Compliance

COM Express® basic, Pin-out Type 6

Dimensions (H x W x D)

125 x 95 mm

CPU

Intel® Xeon®
8th Gen E-2176M, 6x 2.7/4.4 GHz, GT2, 45/35W
9th Gen E-2276ME, 6x 2.8/4.5 GHz, GT2, 45W/35W
9th Gen E-2276ML, 6x 2.0/4.2 GHz, GT2, 25W
9th Gen E-2254ME, 4x 2.6/3.8 GHz, GT2, 45W/35W
9th Gen E-2254ML, 4x 1.7/3.5 GHz, GT2, 25W
Intel® Core™
8th Gen i7-8850H, 6x 2.6/4.3 GHz, GT2, 45/35W
8th Gen i5-8400H, 4x 2.5/4.2 GHz, GT2, 45/35W
8th Gen i3-8100H, 4x 3.0/- GHz, GT2, 45/35 W
9th Gen i7-9850HE, 6x 2.7/4.4 GHz, GT2, 45W/35W
9th Gen i7-9850HL, 6x 1.9/4.1 GHz, GT2, 25W
9th Gen i3-9100HL, 4x 1.6/2.9 GHz, GT2, 25W
Intel® Celeron®
9th Gen G4930E, 2x2.4/- GHz, GT2, 35W
9th Gen G4932E, 2x1.9/- GHz, GT2, 25W

Chipset

Intel® Mobile CM246 (Xeon®) / Intel® Mobile QM370 (Core™)

Main Memory

Up to 4x DDR4-2666 SO-DIMM with up to 128 GByte (non-ECC/ECC) (3rd/4th socket on request)

Graphics Controller

Intel® UHD Graphics P630 for Xeon® processor
Intel® UHD Graphics 630 for Core™ processors
Intel® UHD Graphics 610 for Celeron® processors

Ethernet Controller

Intel® I219LM

Ethernet

10/100/1000 MBit Ethernet

Hard Disk

4x SATA 6Gb/s

Flash Onboard

Up to 1 TByte NVMe SSD (on request)

PCI Express / PCI support

8x PCIe x1, 1x PEG x16

Panel signal

DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit

USB	4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0

Serial

2x serial interface (RX/TX only

Audio

Intel® High Definition Audio

Common Features

SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, support of Intel® Optane™ memory technology via PCIe

BIOS	AMI Aptio V

Humidity

93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)

Options

vPRO (AMT/TXT/AES Support), eDP instead of LVDS, VGA, Intel® Mobile HM370 Chipset,
3rd/4th DDR4 SO-DIMM socket, NVMe SSD

Power Management

ACPI 6.0

Power Supply

8.5 V – 20 V Wide Range, Single Supply Power

Special Features

POSCAP capacitors, Trusted Platfom Module TPM 2.0, Security Chip, 4k Resolutions,
Flexible PEG lane configuration by Setup Option, Rapid shutdown (R E2S variants)

Operating System

Windows® 10, Linux, VxWorks

Temperature

Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating
Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating

Supported Modules

COMe-bCL6(R E2S) xx-xxxxx CM246/QM370

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Datasheets

COMe-bCL6
[ come-bcl6_datasheet.pdf, 2.51 MB, Feb.28.2022 ]

Manuals

COMe-bCL6 User Guide
Rev. 2.3, Oct. 05 2023
[ come-bcl6-user-guide-rev-2-4_2025-01-20.pdf, 3.88 MB, Jan.21.2025 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

White Papers

Robotic-Assisted Surgery White Paper
[ white-paper-beyond-science-fiction-robotic-assisted-surgery.pdf, 6.43 MB, Dec.17.2024 ]

Use Cases

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

Tech Spec Sheet

Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]

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Accessories

COMe Eval Carrier2 T6
38116-0000-00-5

COM Express® Eval Carrier2 Type 6 with 5mm COMe connector

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