COMe-bBD7

COM Express® basic Type 7 with Intel® Xeon® and Pentium® processor D-1500 SoC

Specifications

Intel® Xeon® and Pentium® Processor D-1500 SoC
Dual 10 GbE interfaces
High-speed connectivity x24 PCIe 3.0 + x8 PCIe 2.0, SATA3, USB 3.0
Industrial grade versions

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This COM Express® module COMe-bBD7 extends Kontron’s product family of server-class COM platforms. The module features data-centre-grade CPU performance with up to 16 cores. This robust performance is combined with support for two 10GbE-KR ports making it ideal for network intensive implementations. The KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) on the base board. Furthermore the available NC-Si signals allow for the connection of a Baseboard Management Controller (BMC) on the baseboard for the purpose of enabling out-of-band remote manageability. This enhances reliability and helps reducing the overall operating cost in general.

In addition, the COMe-bBD7 offers high-speed connectivity from configurable PCIe lanes with an up to PCIe x24 implementation for high I/O performance demands such as those required in medical applications. Offering a well-balanced multi-core CPU versus memory-size approach, it supports up to 64 gigabytes (GB) of ECC and non-ECC DDR4 memory.

Features

Compliance

COM Express® basic, Pin-out Type 7 - COM.0 R3.0

Dimension (H x W)

125 x 95 mm

CPU

Intel® Xeon® Processor D-1577, 16 C, 1.3 GHz, 24 MByte, 45 W,
Intel® Xeon® Processor D-1548, 8 C, 2.0 GHz, 12 MByte, 45 W,
Intel® Xeon® Processor D-1537, 8 C, 1.7 GHz, 12 MByte, 35 W,
Intel® Xeon® Processor D-1528, 6 C, 1.9 GHz, 9 MByte, 35 W,
Intel® Xeon® Processor D-1527, 4 C, 2.2 GHz, 6 MByte, 35 W,
Intel® Pentium® Processor D1517, 4 C, 1.6 GHz, 6 MByte, 25 W,
Intel® Pentium® Processor D1508, 2 C, 2.2 GHz, 3 MByte, 25 W,
Intel® Xeon® Processor D-1559, 12 C, 1.5 GHz, 18 MByte, 45 W, ind. Temp
Intel® Xeon® Processor D-1539, 8 C, 1.6 GHz, 12 MByte, 35 W, ind. Temp
Intel® Pentium® Processor D1519, 4 C, 1.5 GHz, 6 MByte, 25 W, ind. Temp

Panel signal

Audio

Main Memory

2x DDR4 SODIMM dual channel up to 2x 32 GByte ECC or non ECC

Graphics Controller

Chipset

Integrated in SoC

Ethernet

10 Gbit Ethernet (KR)

10/100/1000 MBit Ethernet

Ethernet Controller

2x 10 GbE: Integrated in SoC 1x GbE: Intel® I210IT

Storage

2x SATA3, 6Gb/s

Options

PCI Express

24x PCIe 3.0 (6 controllers, x16, x8, x4 configuration)

8x PCIe 2.0 (8 controllers, x4, x2, x1 configuration),
one lane used by onboard 1 GbE LAN controller

USB	4x USB 3.0/2.0

Serial

2x serial interface (RX/TX only)

Common Features

SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC

BIOS

AMI UEFI

Humidity

93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)

Power Management

ACPI 4.0

Power Supply

ATX, 8.5 V – 20 V Wide Range, Single Supply Power

Special Features

Trusted Platfom Module TPM 2.0

Operating System

Linux, Windows® Server 2012 / 2012 R2 / 2016, Windows® 7, Windows® 10, VxWorks 7.x

Temperature

Commercial temperature 0 - 60 °C

Industrial temperature -40 °C to +85 °C (specified SKUs only)

Supported Modules

COMe-bBD7 xx-xxxxxx: commercial temperature
COMe-bBD7R E2 xx-xxxxxx: industrial temperature

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Datasheets

Datasheet COMe-bBD7
[ come-bbd7_datasheet.pdf, 1.8 MB, Apr.20.2023 ]

Manuals

COMe-bBD7 User Guide
Rev. 1.10
[ come-bbd7_user-guide_rev1-10_2023-0714_w2016.pdf, 4.4 MB, Jul.14.2023 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

White Papers

Robotic-Assisted Surgery White Paper
[ white-paper-beyond-science-fiction-robotic-assisted-surgery.pdf, 6.43 MB, Dec.17.2024 ]

Use Cases

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

Tech Spec Sheet

Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]

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Accessories

COMe Eval Carrier T7 Gen2		COM Express® Eval Carrier Type 7	more
COMe Eval Carrier T7 68300-0000-00-0		COM Express® Eval Carrier Type 7	more

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