COM-HPC – Computer-on-Module for High Performance Computing

The new COM standard for High Performance Computing

The usage of standardized Computer-on-Modules in the embedded market shows a long history of success – the best example is COM Express®, the successful and worldwide leading standard for Computer-on-Modules since 2005.

However today the embedded market is facing new challenges..

Applications such as artificial intelligence,  the upcoming 5G wireless standard come with enormous data hunger and require more computing power. This also requires new concepts for embedded computers: existing standards will no longer be sufficient to cope with the growing embedded market demands.

Leading manufacturers in the industry, such as JUMPtec, had set up a working group in the PICMG standardization committee to make the COM standard fit for the future. Computer-On-Modules High Performance Computing -  COM-HPC, complementary to the existing COM Express® standard. Learn more here.
 

COM-HPC

COM-HPC Client Modules

COMh-caRP

COM HPC/Client module size A with 13th Generation Intel® Core™ Processors

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COMh-caAP

COM HPC/Client module size A with 12th Generation Intel® Core™ Processors

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COMh-ccAS New

COM-HPC Client Size C module based on the 12th, 13th and 14th Gen Intel® Core™ S processors

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COM-HPC Server Modules

COMh-sdIL E2 New

COM-HPC®/Server with Intel® Xeon® D-1700 / D-1800 processor family

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COMh-sdID (E2) New

COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 processor family

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COM-HPC Mini Modules

COMh-m7RP (E2) Coming soon

COM-HPC® Mini with 13th Generation Intel® Core™ Processors

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COM-HPC Carrier

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