COM Express® Compact Type 6 with AMD Ryzen™ Embedded V/R1000 APUs
The COMe-cVR6 (E2) deliver a new generation of high-performance, feature-rich Computer-on-Modules based on the standardized COM Express® compact form factor and AMD’s Ryzen Embedded V/R-Series processors. Through the use of consistent COM Express connectors and feature implementation, the COMe-cVR6 is easily exchangeable and offers the most flexibility for customers designing it into their embedded devices based on individual carrier boards.
Besides the high-performance graphics on a SOC level, the COMe-cVR6 offers the option to additionally or alternatively use soldered memory. As a result, the module supports a total of up to 48 GB RAM or provides more thermal and mechanical resistance with up to 16 GB memory down.
Thanks to the fixed connection, soldered memory modules are better to cool and stay in reliable contact even when exposed to extreme vibrations or shocks. Therefore, customers can choose between more storage or greater ruggedness.
Typical application areas can be found in markets such as professional gaming and entertainment as well as medical imaging and surveillance. In addition, the rugged E2 modules – together with memory down option, ECC memory support and industrial grade temp. range usage – meet the special requirements of applications for the Military/Defense and Transportation market.
Compliance | COM Express® compact Pin-out Type 6 |
Dimensions (H x W x D) | 95 x 95 mm |
CPU | AMD V1807B, 4x 3.35 GHz (3.75 GHz), 35-54W AMD V1756B, 4x 3.25 GHz (3.6 GHz), 35-54W AMD V1605B, 4x 2.0 GHz (3.6 GHz), 12-25W AMD V1202B, 2x 2.5 GHz (3.4 GHz), 12-25W AMD V1404I, 4x 2.0 GHz (3.6 GHz), 12-25W AMD R1606G, 2x 2.6 GHz (3.5 GHz), 12-25W AMD R1505G, 2x 2.4 GHz (3.3 GHz), 12-25W |
Chipset | Integrated SoC |
Main Memory | 1x DDR4 SO-DIMM up to 16 GByte, 2nd channel DDR4 memory down up to 16 GByte (non-ECC/ECC) |
Graphics Controller | Integrated AMD Vega Graphics (GFX9) |
Ethernet Controller | Intel® I210/I211 |
Ethernet | 10/100/1000 MBit Ethernet |
Hard Disk | 2x SATA 6Gb/s |
Flash Onboard | - |
PCI Express / PCI support | Up to 5x PCIe 3.0 (On request: 6x without Ethernet) On request: Up to 8x PCIe x1 with 4x PCIe 3.0 + 4x PCIe 2.0 Up to 1x PEG x8 |
Panel signal | DDI1: DP++, DDI2: DP++, DDI3: DP, VGA: -, LVDS: Dual Channel 18/24 bit |
USB | 3x USB 3.x (incl. USB 2.0) + 5x USB 2.0 |
Serial | 2x serial interface (RX/TX only) |
Audio | High Definition Audio interface |
Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
BIOS | AMI Aptio V |
Options | eDP instead of LVDS, VGA, 1x PCIe x1 additional w/o onboard LAN, PCIe Switch, Security Chip |
Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
Power Management | ACPI 6.0 |
Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
Special Features | POSCAP capacitors, Trusted Platform Module TPM 2.0 |
Operating System | Windows® 10, Linux |
Temperature | COMe-cVR6 - commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating COMe-cVR6 E2 - industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
Supported Modules | COMe-cVR6 xxxxxx / COMe-cVR6 E2 xxxxxx |
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